Poštovane koleginice i kolege,
Pozivamo vas na predavanje koje će se održati u utorak 28. maja od 12-13h, u zgradi Naučno-tehnološkog parka, prezentaciona sala 1 – prizemlje.
Predavanje će održati dr Goran Mišković na temu savremenog procesa proizvodnje poluprovodničkih komponenti i integrisanih kola. Predavač će pričati o različitim tehnologijama koje se danas upotrebljavaju kako u Frontend tako i u Backend segmentu proizvodnje. Različite savremene tehnologije za litografiju, metalizaciju, jonsku implantacije, separaciju, pakovanja čipova itd. će biti prikazane i objašnjenje. Predavanje će biti upotpunjeno uzorcima iz različitih segmenata prave proizvodnje koji će prisutnima biti dostupni za analizu i vizuelnu inspekciju.
Nakon predavanja, sledi sesija za pitanja, odgovore i neformalni razgovor u dužini do 30 minuta.
O predavaču:
Dr. Goran Mišković (Senior Project Manager) IEEE Senior member and nanopackaging TC member, certified IMPA C Project Manager. He received his Ph.D. with honors in 2016 from the Vienna University of Technology (TU Wien), where he dealt with metal oxide-based gas sensors, with an accent on the detection of NOx gasses. From 2012 to 2016, he worked as a lecturer and project assistant on two FP7 projects as well as on several bilateral and industrial projects at TU Wien, where he dealt with sensors and actuators. After completion of his doctoral studies, he switched to the industry and joined TDK Electronics, where he worked in the corporate R&D – innovative topic group. His main activities and responsibilities were the evaluation and assessment of new technologies, concepts and ideas. From 2020 to 2023, he has worked at Silicon Austria Labs, Austria’s reputable R&D and competence center, as a member of the Sensor System research division. His main activities and responsibilities were project acquisition, planning & coordination, coordination of SAL science talks and member of PM office contribution toward improvement of operation excellence. Since June 2023 he has joined Infineon Technologies as a member of Technology Excellence group, Predevelopment Team. Dealing with predevelopment and roadmaking activities over the entire FE cluster for all Infineon’s technologies, bridging FE and BE domains. Main research interests are in the fields of heterogeneous integration & packaging, sensors & actuators, additive manufacturing, material science and technology, MEMS devices, microsystem technologies, flexible and wearable electronics and hybrid systems.
